HBM Costs Driven by Physical Construction
zephyr_z9 · x · 2026-07-14
The post discusses a key reason behind rising HBM costs: physical packaging/construction itself is driving up expenses, not just the growth in core DRAM die sizes. The author speculates that if the size growth of core DRAM dies could be constrained moving forward, it might alleviate some pressure, though they admit the physical overhead of HBM5 might be higher, making this difficult to achieve.
More from Infra
- RTK Terminal Compression Cuts Tokens but Leaves Your AI Coding Bill Unchanged — Bartaseth · 2026-09-11
- SF Compute founder: buying compute is 'an absolutely awful experience' right now — IgorCarron · 2026-09-11
- SmolVM open-sources persistent computer infrastructure for agents that outlive chat sessions — aniketmaurya · 2026-09-11
- PyTorch Day Korea 2026 launches first offline conf, CFP closes Sept 13 — PyTorch · 2026-09-11
- Local LLM server dilemma: 4x CMP-170HX (price up 53% in 20 days) vs Mac Studio M5 Ultra — rumboll · 2026-09-11
- llama.cpp lands Flash Attention tuning for RDNA4, big prefill gains on AMD — pmttyji · 2026-09-11