HBM Costs Driven by Physical Construction
zephyr_z9 · x · 2026-07-14
The post discusses a key reason behind rising HBM costs: physical packaging/construction itself is driving up expenses, not just the growth in core DRAM die sizes. The author speculates that if the size growth of core DRAM dies could be constrained moving forward, it might alleviate some pressure, though they admit the physical overhead of HBM5 might be higher, making this difficult to achieve.
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