EE perspective: AI compute grows 10.6 dB per year as 3D hybrid bonding looms

An EE-focused chart notes AI training compute doubles roughly every 7.1 months, or 10.6 dB per year. Meanwhile, the Yoo2026 paper envisions 3D electro-optic hybrid integration, stacking DRAM, MRAM, silicon photonics and III-V layers on XPUs via DBI hybrid bonding.

2026-11-11 ~ 2026-11-11 · 2 related posts

• EE jokes about AI progress chart: training compute growing 10.6 dB per year — jwt0625 · 2026-11-11
• Paper envisions 3D EIC-PIC stacks with layered RAM and photonics on XPU; commenters doubt the thermals — jwt0625 · 2026-11-11