3.2T 交换机近封装光学用玻璃基板聚合物波导,宣称降功耗 50%
jwt0625 · x · 2026-10-13
jwt0625 reacts to a report that 3.2T near-packaged optics will use glass substrates to cut AI switch power 50%. The design replaces VCSEL microlens arrays with DOW polymer optical waveguides that work directly in immersion cooling fluid, eliminating active alignment and multi-channel lens assemblies for lower manufacturing complexity, near-zero crosstalk and higher reliability. The author suspects a high-throughput TPP startup is involved but doubts the 50% power claim.
所属事件:聚合物波导与玻璃基板推动近封装光学散热与降耗突破(2 条相关)→
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