TSMC reportedly raising CoWoS packaging prices up to 20% next year on AI chip demand
Beth_Kindig · x · 2026-10-31
TSMC is reportedly planning to increase CoWoS advanced packaging prices by up to 20% next year, as demand keeps growing across GPUs, server CPUs and custom silicon. The move directly affects major customers like NVIDIA, AMD and Broadcom, and underscores continued tightness in the AI compute supply chain.
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