Taiwan media corroborates TSMC CoWoS price-hike report: equipment lead times up to 8 months
rohanpaul_ai · x · 2026-10-27
This follow-up links the original Commercial Times article behind the TSMC CoWoS price-hike rumor. Extra details: customers stopped bargaining on equipment purchases this year; new packaging fabs take about three years from groundbreaking to bottleneck full load; CoWoS monthly capacity is estimated above 130k wafers in 2026 with a 200k target for 2027; expansion spans Chiayi AP7, Tainan AP8 P2, AP6 SoIC, and the US AP1 fab slated for 2028.
Related event: TSMC Reportedly Raising CoWoS Advanced Packaging Prices by Up to 20%(2 posts)→
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