TSMC reportedly preparing another CoWoS price hike of up to 20% as AI packaging demand outstrips supply
rohanpaul_ai · x · 2026-10-27
Supply chain reports say TSMC is readying another round of CoWoS advanced packaging price increases of 10–20%, with some lead times already stretched.
- Demand has spread from AI GPUs to server CPUs and custom ASICs
- Equipment lead times grew from 3–6 months to 6–8 months; buyers no longer haggle
- Larger packages cut each tool's hourly output, deepening the squeeze
- TSMC chairman C.C. Wei says 5x reticle-size packages are in mass production with excellent yields; 9x and 14x are planned
Analysts estimate CoWoS monthly capacity exceeding 130k wafers in 2026, targeting 200k in 2027, with the US AP1 packaging fab slated for 2028.
Related event: TSMC Reportedly Raising CoWoS Advanced Packaging Prices by Up to 20%(2 posts)→
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