Lattner: datacenters will be multi-vendor, so Modular and Qualcomm back a unified compute standard
clattner_llvm · x · 2026-10-23
In the original post, Lattner explains that Modular and Qualcomm are releasing this to catalyze an open and unified future for heterogeneous compute: datacenters will be filled with chips from multiple vendors, and a unified standard ensures silicon is the best and multi-vendor. A release blog and all-day LLVM Dev Meeting tutorial track accompany the announcement.
Related event: Modular and Qualcomm Launch Open Standard for Heterogeneous Computing(3 posts)→
More from Infra
- EPFL demos ~100GHz-spacing TFLT WDM modulator chip; expert doubts CPO fit — jwt0625 · 2026-10-24
- ai& cuts MiniMax H3 video generation from 229s to 19s across NVIDIA, AMD, Tenstorrent — DavidBennett__ · 2026-10-24
- Local AI benchmarks miss thermal throttling — a stand can boost NVIDIA Spark perf — draginol · 2026-10-24
- Cloudy: autonomous cloud research agent hand-writes Triton kernels that beat tuned vLLM by up to 15% — saurabhtwq · 2026-10-24
- Chamath: major US bank cut AWS and GCP spend, built six self-run data centers — SumitGup · 2026-10-24
- OpenRouter slide shows token usage exploding as blended cost per token keeps falling — aniketmaurya · 2026-10-24