JNTC cuts TGV glass substrate copper filling from a day to minutes, targets 2027 mass production
toptickcrypto · x · 2026-10-22
Korea's JNTC has dramatically sped up copper filling in through-glass via (TGV) structures, cutting the process for a 510x515mm, 2mm-thick glass substrate from half a day to over a day down to minutes. The key is an hourglass-shaped microvia structure that anchors copper from both ends, plus a proprietary metallization process that eliminates voids and the dimple effect. The company has completed validation with a US semiconductor customer and plans mass production of glass cores in 2027. Vietnam import data also shows 8,300 kgs of polishing consumables for HDD glass substrates shipped to JNTC Vina, suggesting late-stage prep for mass production.
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