NVIDIA expands supply chain: substrate capacity to grow 2.5x, Amkor packaging up 300%
nvidia · x · 2026-10-21
NVIDIA announced capacity agreements with Amkor, IBIDEN, KYEC, Samsung Electro-Mechanics, SPIL and Unimicron to expand substrates, advanced packaging, testing and optical engines. Key numbers: 2.5x substrate capacity over three years, Amkor packaging +300% by end of 2028, a $1.1B capacity reservation advance for KYEC's US facilities, and SPIL targeting 15x co-packaged optics engine capacity by mid-2027. Jensen Huang called it the largest infrastructure buildout in history, with capacity as the constraint.
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