Advanced Packaging Atlas Catalogs 239 Papers and 770 Test Vehicles to Map the "Mess" of Chip Packaging
jwt0625 · x · 2026-10-20
jwt0625 is building a public "Advanced Packaging Atlas" — quipping that "this whole industry is a mess" — to bring order to advanced chip packaging data. Screenshots show its scale and structure:
- 239 papers, 770 test vehicles, 16,792 processed rows, 293 organizations, covering 59 micro-bond TSV types and 102 through-via TSV types
- By bucket: hybrid bonding 3D (34), microm-bump 3D (58 combined), thermal/power delivery (24), glass interposer (23), Si interposer (22)
- By package class, hybrid-bonded 3D (90) and panel-level (70) lead; micro-bump (191) dominates interconnect types
- Detail views expose per-paper vehicle parameters — e.g., a 120mm×120mm extreme 2.5D package study with a 14,400mm² Si interposer, 40µm micro-bump pitch, and 12 stack layers
A rare cross-industry database for anyone tracking chiplets, 2.5D/3D packaging, and CoWoS-lineage technology.
Related event: Advanced Packaging Atlas Goes Public With 239 Papers and 770 Test Vehicles(2 posts)→
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