Fiber-based co-packaged optics demo shows few dies in 2025, Intel's COUPE urged to hurry
jwt0625 · x · 2026-10-19
jwt0625 shares the Baker2025 paper 'Demonstration of Co-Packaged Optics Assembly for Fiber-Based Optical Interconnect' and quips that in 2025 the demo still integrates only a handful of dies. He likes the PIC built into the substrate and calls on Intel to ship COUPE faster. Figures show a CHIPS multi-chip package pairing an Intel Stratix-10 FPGA with electrical ICs and Columbia University photonic ICs via EMIB, plus simulated delamination risk at 260°C.
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