Broadcom optical roadmap: 1,000+ fibers per chip package, 400G direct drive
firstadopter · x · 2026-10-13
A slide from Broadcom's OCP Global Summit 2026 talk lays out three challenges on its integrated photonics roadmap:
- Advanced packaging: high-density, high-quality PIC-to-EIC attach, signal integrity optimization, and enablement for 400G direct drive
- Optical connectivity: more than 1,000 fibers connecting to each chip package, with detachable fiber connectivity to allow package reflow
- Volume manufacturing: industry-leading yield and reliability via automated assembly and test for system partners
Related event: Broadcom unveils optical interconnect roadmap with 102.4T Tomahawk 6(2 posts)→
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