TSMC and ASML explore 12-inch photomasks to unlock High-NA EUV full-field potential
pstAsiatech · x · 2026-10-12
Per DigiTimes, TSMC and ASML are eyeing 12-inch photomasks to unlock High-NA EUV lithography's full-field potential. Current High-NA EUV halves the exposure field with 6-inch masks, forcing extra exposures at advanced nodes; larger masks would restore full-field exposure and cut cost per chip — a notable signal for the AI compute supply chain (original article paywalled/blocked).
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