ASML drops bookings, TSMC's CoWoS allocation, record chip packaging price hikes
tengyanAI · x · 2026-10-12
A weekly watchlist for AI infra companies:
- ASML reports Wednesday: no more bookings disclosures this year; the key line is whether it holds its €43-45B 2026 outlook (Q3 guided €11-12B). ASML is also reportedly raising spare-part prices 10% in Korea from January (unconfirmed) — clear pricing power even on the installed base.
- TSMC reports Thursday: watch how much CoWoS capacity it keeps handing out; it just signed GlobalFoundries to make US interposers, $2B over five years, ramping in 2028.
- Packaging/test pricing: Taiwan press says packaging and test prices are seeing their biggest rise ever; no company has confirmed a number yet. If ASE or KYEC does, packaging is still the tight link.
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