Cerebras CEO: architecture choices sidestep HBM, CoWoS and TSMC 3nm bottlenecks
rohanpaul_ai · x · 2026-10-04
Cerebras co-founder and CEO Andrew Feldman explained on The MAD Podcast the three supply-chain bottlenecks squeezing the AI accelerator industry: HBM memory, CoWoS packaging capacity, and access to TSMC's 3nm node.
Cerebras largely sidesteps all three by architectural choice:
- No reliance on HBM or CoWoS packaging
- Current chips fabbed on 5nm rather than 3nm
In an industry where memory, advanced packaging and leading-edge fab capacity directly constrain shipments, this gives Cerebras a materially different supply profile from mainstream GPU systems. Full video on The MAD Podcast and Cerebras' YouTube channel.
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