Kirin 9050 die shot revealed: 120.6mm² on TSMC N2P, alongside 2026 flagships
zephyr_z9 · x · 2026-10-02
Kurnal Insights published a high-res die shot of HiSilicon's Hi36E0 (Kirin 9050), measuring 11.13×10.84mm (120.6mm²) on TSMC N2P, dated 2026. The gallery allows comparison with other 2026 flagship SoCs: Snapdragon 8 Elite Gen6 (133.2mm², N2), Dimensity 9600 Pro (134.0mm²), and Apple A20 Pro (98.8mm², N2P).
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