Chip stacking bottleneck: turnaround time and click count, with two key papers
jwt0625 · x · 2026-09-29
The author argues the industry has recognized that the real bottlenecks in multi-chip integration are turnaround time and the number of process steps required, citing Gutierrez-Aitken 2017 on integrating diverse semiconductor technologies for better performance at lower cost, and Sengupta 2024's overview of Northrop Grumman's Microelectronics Center, pointing to heterogeneous integration and advanced packaging as key to future compute performance.
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