Clean pre-dicing photonic wafer shows low-power InGaAsP-on-silicon phase modulators
jwt0625 · x · 2026-09-23
A poster shared a photo of a very clean photonic chip wafer before dicing, identifying the devices as very low-power phase modulators with heterogeneous InGaAsP on silicon, and questioning how these wafers are diced — whether the process is done twice.
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