Alibaba unveils Zhenwu V900 AI chip as Armenia's 70k-GPU cluster and Samsung HBM4 expansion make waves
创业邦 · wechat · 2026-09-23
A roundup of infra and hardware news: Alibaba's T-Head launched the Zhenwu V900 AI chip with 3x the compute of M890 and clusters scalable to 500k cards; Samsung's glass carrier cleaning ramp hints HBM4 output may double next year; Firebird's Armenia data center will host 70k+ NVIDIA chips at 300MW by end of 2026. LG-Microsoft expanded their AI data center partnership, Apple may adopt CoE OLED in 2029 iPhones, and XPeng Robotics completed supply chain audits as Tesla's robot team also audits Chinese suppliers.
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