Rumor: SK Hynix and Micron may turn to Intel 18A-P for HBM5 base die in late 2028
zephyr_z9 · x · 2026-09-22
Unconfirmed analyst chatter suggests a potential HBM supply chain shift: TSMC may handle HBM4/HBM4E base dies, while SK Hynix and Micron — facing yield problems with their internal base die options (SK N12, Micron in-house) — could switch to Intel 18A-P for HBM5 in late 2028, described as their only viable path; Samsung N7 and Intel 3 deemed unsuitable for HBM4 base die.
More from Infra
- Rackspace joins NVIDIA Cloud Partner Program with Blackwell pods for regulated enterprises — DavidLinthicum · 2026-09-22
- Bridging LLM Decision Readouts into DuckDB: Zero-Token Probabilistic Classification via LuaJIT UDFs — Shoddy_Telephone9702 · 2026-09-22
- Nvidia launches DSX Ready to certify AI factory power and cooling, Tesla and LG first in line — emmanuelvivier · 2026-09-22
- ContextBridge: an open-source pool that routes AI tasks across local machines, APIs and shared hosting — IamAngusU · 2026-09-22
- SENPAI Auto-Research Agent Writes Kernels, Cuts Training Time 22% (26h to 22h) — morgymcg · 2026-09-22
- Qwen3.8-27B hits >70 tok/s and full 262k context on 2x3090 with vanilla vLLM — maqifrnswa · 2026-09-22