Samsung to double HBM4/HBM4E output next year, glass carrier orders to hit 50k/month
zephyr_z9 · x · 2026-09-20
Samsung Electronics is expected to at least double production of its HBM4 and next-gen HBM4E memory next year, per Korean semiconductor industry sources. To support the ramp, Samsung will raise outsourced cleaning of glass carriers — glass supports that hold wafers while HBM DRAM is thinned — from 20,000 units per month this year to 50,000 per month, 2.5x this year's level. The surge underscores glass substrates' growing role in advanced packaging supply chains.
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