Kirin 9030S teardown confirms N+2 node; Kirin 9050 Pro pairs N+3 with N+2
teortaxesTex · x · 2026-09-18
Teardown details show Huawei's Kirin 9030S (Hi36D0G-GPCV100, in Pura 90 Pro Max) has a 122mm² die, 63nm CPP, 252nm cell height and 0.0315µm² SRAM cell — confirming SMIC N+2, not N+3. The Kirin 9050 Pro decap is ongoing and appears to use an N+3 bond with N+2, with an even smaller die. Commenters infer Huawei isn't even fully using SMIC's best process yet, suggesting a substantially better 2027 chip.
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