Glass core substrates show 2x better warpage than organic core without stiffener
jwt0625 · x · 2026-09-12
- A technical discussion on advanced packaging: glass core substrates achieve over 2x better warpage control than organic-core substrates with stiffener — without needing a stiffener at all.
- Cites the paper "Glass Core Substrates – Next Generation Advanced Packaging Platform for AI and HPC," positioning glass substrates as the next-gen packaging platform for AI and HPC chips.
- The poster highlights the aesthetics of the copper TGVs (through-glass vias).
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