Micron to nearly double HBM capacity to 100K wafers/month by year-end, challenging Samsung and SK Hynix

zephyr_z9 · x · 2026-09-12

Korean media reports Micron plans to add 60,000 wafers/month of HBM capacity by year-end, bringing total capacity to 100K wafers/month — nearly double last year's 40-50K. SK Hynix is expected to reach 200K and Samsung 250K wafers/month, but Micron's expansion is the most aggressive in relative scale.

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