Micron to nearly double HBM capacity to 100K wafers/month by year-end, challenging Samsung and SK Hynix
zephyr_z9 · x · 2026-09-12
Korean media reports Micron plans to add 60,000 wafers/month of HBM capacity by year-end, bringing total capacity to 100K wafers/month — nearly double last year's 40-50K. SK Hynix is expected to reach 200K and Samsung 250K wafers/month, but Micron's expansion is the most aggressive in relative scale.
- Micron's HBM4 12-Hi mix is expected to rise from 20-30% of output to as much as 50% by year-end, though the poster notes it may fall as more SKUs move to 8-Hi
- Micron already ships 12-Hi 36GB HBM4 for Vera Rubin (mass production since March) and sampled 16-Hi 48GB parts
- Q2 HBM revenue share per Counterpoint: SK Hynix 50%, Samsung 33% (up from 21% in Q1), Micron 18% (down from 21%)
Related event: Micron to Double HBM Capacity to 100K Wafers per Month(2 posts)→
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