Photonic interposer only 2x gain? Coupling of DLW chip to PIC questioned
jwt0625 · x · 2026-09-12
A technical discussion on photonic interconnects: the author notes a photonic interposer approach appears to deliver only 2x gains, citing 1 dB insertion loss at 95% yield.
He also critiques the cited Zhang 2026 paper (on a detachable edge-coupling connector with a glass coupler and expanded beam for CPO) for being vague about how the DLW chip couples to the PIC, hand-waving it as thermal compression bonding (TCB) "and similar" high-precision assembly processes.
Related event: CPO Edge-Coupled Connector Paper Questioned Over Missing Coupling Details(2 posts)→
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