Intel extends High NA EUV lead as TSMC and Samsung confirm adoption by end of decade
BenBajarin · x · 2026-09-08
Analyst Ben Bajarin recaps the day's lithography news: Intel is making progress scaling High NA EUV for customers with mature solutions, extending its timing lead for customer use around 2028/29, while TSMC and Samsung have both confirmed bringing High NA EUV into production by the end of the decade.
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