High-NA Lithography Halves Exposure Field; 6x12-inch Masks Emerge as Long-Term Fix
BenBajarin · x · 2026-09-08
High-NA EUV halves the exposure field, cutting the maximum die size per shot in half. The current workaround stitches two half fields into one die on today's 6-inch masks. Long term, 6x12-inch masks are the answer to recover a full die with no seam — but that requires ecosystem alignment, which ASML and Intel are spearheading.
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