Hybrid bonded HBM hypothetical market: over 3 billion D2D applications per year
zephyr_z9 · x · 2026-09-06
The post sizes the hypothetical market for hybrid bonded HBM: assuming 16-Hi stacks and 200M HBM stacks per year, that implies over 3 billion die-to-die interconnect applications annually — far larger than hybrid bonding's current use in CPO. A quoted reply notes buyside investors may still panic over HBM supply expectations.
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