Bump-less 3D stacking goes practical: Intel Diamond Rapids first, AMD Zen rumored next
bookwormengr · x · 2026-09-06
A technical thread on 3D-stacked chips: bump-less hybrid bonding is becoming practical — Intel announced it for next-gen Diamond Rapids at HotChips 2026, and AMD is rumored to adopt it for Zen.
- Bottom-tier memories are SRAMs; D-Matrix has shown a DRAM stacking design using micro-bumps, a pre-hybrid-bonding tech.
- Key challenges: heat escape when logic sits below memory, and power delivery when logic sits above.
- On Huawei's chief scientist's power claim: the tech cuts package-level power and heat but creates intense local hotspots — not a simple cooling win.
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