CXMT's 3D DRAM roadmap: risk production in 2028, mass production in 2029
zephyr_z9 · x · 2026-09-04
A leaked roadmap suggests CXMT plans risk production of 3D DRAM in 2028 and mass production in 2029.
On the tooling side, Naura has developed a uniform and selective cyclic two-step fluorine-based etch for SiGe/Si multilayers, already demonstrated on 64 stacked SiGe/Si bi-layers — presumably tied to CXMT's 3D DRAM efforts. Together these signal China's memory supply chain pushing toward 3D DRAM.
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