AI buildout bottleneck: US-made wafers still fly to Asia for packaging as capacity grows overseas
ashwinl · x · 2026-09-04
Citing a same-day meeting where the Thai and Singaporean PMs agreed on Singaporean investment in Thai semiconductors, the author argues the AI buildout is gated on chip packaging capacity — which is being built outside the US right now. Even a leading-edge wafer fabricated in Arizona must still fly to Taiwan or Southeast Asia to become a shippable part.
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