Micron: HBM Requires Three Times More Wafer Area Than DDR5
FullstackSensei · reddit · 2026-08-28
Micron revealed at Hot Chips 2026 that HBM requires approximately three times the wafer area of DDR5 for the same capacity, a ratio unlikely to improve with new generations. Factors like 256 memory banks in HBM4 vs. 32 in DDR5, plus TSVs and power delivery, drive this cost. Each 1GB of HBM effectively removes 3GB of regular DRAM capacity. The shift by major manufacturers to HBM has cut DRAM supply by two-thirds, suggesting ongoing constraints.
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