SK hynix to build first US HBM packaging base in Indiana for $4B
rohanpaul_ai · x · 2026-08-28
SK hynix is investing $4 billion to build its first high-bandwidth memory (HBM) packaging base in the US, located in Indiana. The 133.5-acre site expects to open its cleanroom by October 2028, with mass production of next-gen HBM starting in H2 2029. The US government is backing the build with up to $458M in grants and $500M in loans under the CHIPS Act.
Related event: SK hynix Breaks Ground on $4B US HBM Packaging Site(2 posts)→
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