Chinese chip packaging firms invest $2.2B in expansion fueled by AI boom
pstAsiatech · x · 2026-08-26
Driven by surging AI demand, China's top three packaging firms (JCET, Tongfu, Huatian) reported triple-digit profit growth and announced a combined 15 billion yuan ($2.2 billion) expansion drive. JCET's net profit rose 79.4% YoY, with a new 7.8 billion yuan facility for high-end AI chips planned in Shanghai.
More from Infra
- CPU vs GPU vs TPU vs NPU vs LPU: 5 Hardware Architectures Explained — HankYeomans · 2026-08-26
- Alibaba Unveils Qwen3.8-Flash Preview: MoE Model with Next-Gen Architecture — Alibaba_Qwen · 2026-08-26
- India holds just 0.2% of global compute capacity — himanshustwts · 2026-08-26
- Linux Foundation Celebrates 35th Anniversary, Open Source Targets AI — 0xsachi · 2026-08-26
- Open Source Facefusion Android App Runs Video Face Swap on Snapdragon NPU — Few_Caregiver8134 · 2026-08-26
- Apple M5 Mac Studio page features LM Studio for local AI — mattturck · 2026-08-26