3D die stacking is the new norm at Hot Chips 2026
appenz · x · 2026-08-25
At Hot Chips 2026, 3D die stacking has become the new standard. Showcased examples include: Intel Diamond Rapids stacking cores on cache and fabric manager; Fujitsu stacking compute on SRAM; d-Matrix stacking DRAM on compute; and HBM stacking 4/8/16 layers of RAM. GPU related talks have not even started yet.
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