China advances in IGZO-based 3D-DRAM, nearing 3D NAND fabrication style
xiaosun86 · x · 2026-08-25
The tweet suggests that AI practitioners should look beyond ML conferences like NIPS and ICML to hardware venues such as IEEE EDL, TED, IEDM, and VLSI. It cites progress by China in BEOL 3D-DRAM based on stacked layers of IGZO transistors, noting that the latest version is closer to 3D NAND fabrication style than prior epitaxial multilayer approaches.
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