Xiaomi Local AI Host Revealed: Features 6nm Wafer-on-Wafer NPU-DRAM Chip
teortaxesTex · x · 2026-08-24
Xiaomi released the Local AI Host, equipped with XRING O3, O100, and D100 chips for local AI model deployment. The O100 chip stands out with its 6nm process and wafer-on-wafer NPU-DRAM bonding technology at 1.4µm pitch, similar to Logic Folding philosophy. TSMC is reportedly the fab. This high-integration solution aims to boost on-device AI computing efficiency.
Related event: Xiaomi Unveils Three-Chip AI Cube Prototype Running 120B Models Locally(11 posts)→
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