Xiaomi Local AI Host Revealed: Features 6nm Wafer-on-Wafer NPU-DRAM Chip

teortaxesTex · x · 2026-08-24

Xiaomi released the Local AI Host, equipped with XRING O3, O100, and D100 chips for local AI model deployment. The O100 chip stands out with its 6nm process and wafer-on-wafer NPU-DRAM bonding technology at 1.4µm pitch, similar to Logic Folding philosophy. TSMC is reportedly the fab. This high-integration solution aims to boost on-device AI computing efficiency.

Related event: Xiaomi Launches Local AI Host with Three In-house Chips for On-device Inference(7 posts)→

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