Broadcom reportedly in talks to raise up to $100B in debt for AI chip projects
创业邦 · wechat · 2026-08-22
- Massive Financing Plans: Broadcom is reportedly negotiating with Blackstone and Apollo Global Management to raise between $60 billion and $100 billion in debt financing to fund AI chip initiatives.
- Structure & Beneficiaries: The debt will be issued via a Special Purpose Vehicle (SPV) with partial guarantees from Broadcom. Funds will support the deployment of 1 GW of Broadcom custom chips in datacenters built for Fluidstack, with compute capacity ultimately purchased and used by Anthropic.
- Context: This follows the June establishment of the "AIXPV platform" partnership between Broadcom, Blackstone, and Apollo aimed at accelerating AI infrastructure.
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