SK hynix preps for post-HBM era with 3D stacking shift
zephyr_z9 · x · 2026-08-20
Citing industry commentary, the post suggests SK hynix is preparing for a 'post-HBM era.' While HBM remains critical for decode throughput, the shift is moving from 2.5D packaging (around the logic die) to 3D packaging (on top of the logic die, e.g., zHBM). This positions the company to respond to potential disruptions from memory disaggregation.
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