SK hynix preps for post-HBM era with 3D stacking shift
zephyr_z9 · x · 2026-08-20
Citing industry commentary, the post suggests SK hynix is preparing for a 'post-HBM era.' While HBM remains critical for decode throughput, the shift is moving from 2.5D packaging (around the logic die) to 3D packaging (on top of the logic die, e.g., zHBM). This positions the company to respond to potential disruptions from memory disaggregation.
More from Infra
- Haight Street Compute Market: a one-day trading floor for GPU deals in SF — ctjlewis · 2026-10-16
- Temporal Serverless Workers on Cloud Run: queue-driven autoscaling, scale to zero — rseroter · 2026-10-16
- LMA brings day-0 model support to TPU for the first time, spanning NVIDIA, AMD, Intel via SGLang — ying11231 · 2026-10-16
- Semtech's analyst-day slide cleanly explains the four signal-integrity impairments — BenBajarin · 2026-10-16
- Fortytwo Engine boosts Qwen3.8-27B accuracy 7% and cuts tokens 25% via Swarm Inference — rohanpaul_ai · 2026-10-16
- Berkeley scholars: concentrated chip supply chain makes a hardwired frontier AI pause feasible — wfithian · 2026-10-16