TSMC 3nm Capacity to Reach 180K Wafers/Month Early in Q4
Beth_Kindig · x · 2026-08-14
TSMC's 3nm process capacity is reportedly expected to reach 180,000 wafers per month by early Q4.
- Ahead of Schedule: This capacity expansion is 2 to 3 months ahead of market expectations.
- Demand Driven: The rapid ramp-up is primarily driven by strong customer orders.
- Key Clients: Major tech companies like Nvidia ($NVDA), Broadcom ($AVLO), AMD ($AMD), and Apple ($AAPL) are the core forces pushing this capacity increase.
More from Infra
- New hardware day: local LLM deployment the moment it arrives — lxfater · 2026-10-16
- Together AI's score centering fixes RL training collapse under quantized inference — nrehiew_ · 2026-10-16
- Inference is splitting prefill and decode across specialized chips, not just H100s — AccBalanced · 2026-10-16
- Rebasely launches in beta: Git hosting built for humans and coding agents — handotdev · 2026-10-16
- Drama3 TTS lands in audio.cpp: up to 5x real-time on RTX 5090, <8GB VRAM mode too — Acceptable-Cycle4645 · 2026-10-16
- Three CoreWeave co-founders have sold $3.3B in shares since IPO amid credit worries — SumitGup · 2026-10-16