10kAmp AI Chips Face Severe Power Delivery and Cooling Challenges
jwt0625 · x · 2026-08-08
Surging AI compute demands are pushing hardware infrastructure to extreme physical limits. Two recent papers highlight critical bottlenecks in next-gen AI chip integration:
- Cooling & Packaging: A 2025 ECTC study notes that implementing micron channel liquid cooling at the PCB level is highly challenging. Furthermore, dual-side BGA assembly for ASICs and Vertical Power Modules (VPM) faces significant yield issues.
- 10kAmp Power Delivery: Another paper discussing 10,000-amp AI chips indicates a system-level shift from lateral to vertical power delivery. To meet extreme power demands, researchers call for better electron-photon conversions, even exploring direct power delivery via light.
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