Winbond Expands to Become Top SLC NAND Supplier by 2027 Amid AI Demand
zephyr_z9 · x · 2026-08-07
Winbond, a major Taiwanese memory chip maker, plans to become the world's largest supplier of SLC NAND flash by 2027. Driven by surging demand from emerging sectors like robotics, drones, and low-earth-orbit satellites, Winbond's NAND Flash revenue soared 65% in Q2, with SLC NAND accounting for 40% of the total.
To meet this robust demand, Winbond is shifting to 24nm production nodes to expand supply and ramping up capacity at its Kaohsiung fab from 15,000 to 24,000 wafers per month. Industry observers also note that Kioxia's XL-FLASH will utilize SLC and MLC NAND, suggesting that the market may currently be underestimating the overall demand for SLC technology.
More from Infra
- ByteDance Rumored to Pre-Train 10T Parameter Model; Distillation Predicted for Serving — zephyr_z9 · 2026-08-07
- AI Inference is Memory-Constrained: A Shift Could Bullish Memory Chips — toptickcrypto · 2026-08-07
- Inference Compute Jumps to Two-Thirds of AI Workloads, Reshaping Profit Pools — msharmas · 2026-08-07
- Analysis: LLM Inference Value Shifts from Engines to Data Centers and GPU Capacity — zhyncs42 · 2026-08-07
- Nvidia Seeks China 6G Base Station Suppliers; Microsoft Expands India Cloud — 创业邦 · 2026-08-07
- LightX2V Enables 14B Video Model on Single RTX 5090 with 720p Real-time Generation — 新智元 · 2026-08-07