TSMC CoWoS Capacity Forecast to Exceed 2.3M Wafers by 2027, Significantly Revised Upwards
Beth_Kindig · x · 2026-08-01
Analyst Beth Kindig reported that TSMC's CoWoS packaging capacity is expected to grow rapidly from 675K wafers in 2025 to 1.275M in 2026. Furthermore, the 2027 forecast has been significantly revised upwards to 2.31 million wafers from a previous estimate of 1.74M, reflecting accelerating AI-driven demand.
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