Extropic Plans First US Thermodynamic Computing Fab, Backed by $75M CHIPS Funding
JosephJacks_ · x · 2026-07-30
- Startup Extropic aims to establish the first U.S. manufacturing capability for thermodynamic computing.
- The company signed a non-binding LOI with the Department of Commerce for up to $75M in CHIPS R&D funding.
- The investment will support deploying large-scale TSU clusters and fabricating the Z1.5 chip at an American foundry.
- The chips are designed to improve energy efficiency for probabilistic AI at the edge (including defense, autonomous systems, and biology) while reducing reliance on offshore fabs.
Related event: Extropic Gets $75M LOI from US Commerce Dept for Thermodynamic Chip Line(5 posts)→
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