Extropic lands $75 million LOI from the U.S. Commerce Department for AI computing chips
beffjezos · x · 2026-07-29
Extropic says it signed a $75 million letter of intent with the U.S. Department of Commerce to scale its thermodynamic computing hardware for AI workloads.
- The planned CHIPS-funded effort would help expand Thermodynamic Sampling Units.
- The company also says the chips would be fabricated at an American foundry, signaling an onshoring push.
Related event: Extropic Gets $75M LOI from US Commerce Dept for Thermodynamic Chip Line(5 posts)→
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