Nvidia, Google, AMD and Amazon now dominate CoWoS and HBM demand
Beth_Kindig · x · 2026-07-28
Nvidia, Google, AMD and Amazon were responsible for about 90% of CoWoS demand and 92% of HBM demand in 2025, underscoring that advanced packaging and memory, not just leading-edge logic dies, are the main AI chip bottlenecks.
The accompanying chart shows:
- CoWoS packaging: Nvidia 60%, Google 14%, AMD 8%, Amazon 7%, others 10%
- HBM: Nvidia 69%, Google 7%, AMD 10%, Amazon 6%, others 8%
- Advanced logic dies (3–5nm): Nvidia only 9%, with others taking 88%
The post argues that AI chip production is now constrained more by packaging capacity and HBM supply than by raw compute die output.
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