Huawei’s 950 NPU reportedly uses 4 dies and separate SerDes dies
teortaxesTex · x · 2026-07-25
Huawei’s 950 NPU is being discussed as an unusually bold chip design:
- It reportedly uses SMIC rather than TSMC.
- The chip is multi-die with 4 dies, compared with 2 dies in Blackwell.
- Its SerDes are placed on separate dies, which may improve manufacturing yield.
- The poster argues the chip’s FLOPs per die are lower, but the architecture could still scale in surprising ways as Huawei ramps production.
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