Intel says advanced packaging backlog is building, with billions in sight
BenBajarin · x · 2026-07-24
Intel's CFO said the foundry business is really two businesses: wafers and advanced packaging.
- He said Intel is already seeing backlog in advanced packaging and that Lip-Bu Tan now has visibility to billions of dollars of business there.
- He also said Intel is undershipping data-center supply by a significant amount, and expects that to continue in Q2, Q3, and Q4 — effectively three quarters of catching up with demand.
- The comments suggest packaging is becoming a differentiated business line, separate from co-packaging.
Related event: Intel Q2 Earnings Beat Expectations, AI and Foundry Demand Drive Up CapEx(11 posts)→
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