DDR5 stays the tightest AI supply bottleneck as U.S. data-center power demand jumps
tengyanAI · x · 2026-07-22
An AI buildout desk update says DDR5 DRAM remains the tightest constraint in the AI supply chain, with HBM3e still second.
- BNEF now expects U.S. data center electricity demand to rise 83% by 2035, keeping power and interconnection as the long pole.
- Silicon Motion pushed its memory-shortage outlook through H2 2028, suggesting the DRAM squeeze is not short-lived.
- ABF substrate prices keep rising, adding more evidence that advanced packaging remains under pressure.
- The next watchpoints are Shin-Etsu, Disco, and BE Semiconductor results.
Related event: DDR5 and Power Emerge as Biggest Bottlenecks in AI Supply Chain(2 posts)→
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