TSMC and ASML Continue Capacity Expansion
imjustnewatai · x · 2026-07-20
TSMC stated that AI chip demand has entered a phase of 'multi-year structural demand,' expanding its investment in Arizona, USA, to 2650 亿美元. Plans include:
- 12 wafer fabrication and advanced packaging facilities
- A new R&D center
- Producing increasingly advanced chips domestically in the US
Meanwhile, ASML noted that its expanded EUV capacity is almost entirely booked through 2027, with plans to increase capacity by another 30% in both 2027 and 2028.
The core takeaway is that AI compute build-out isn't slowing down; it is scaling comprehensively across the entire supply chain, from GPUs, custom accelerators, memory, and advanced packaging to fabs, lithography machines, power, and data centers.
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